Author
Blake Wood
Publish Date

The University Illinois Springfield will offer in-state tuition to out-of-state students from the St. Louis and Quad Cities areas starting in Fall Semester 2024. The University of Illinois Board of Trustees approved the three-year pilot tuition program at its July 20 meeting in Chicago.

“By implementing this program UIS will be able to enhance its competitiveness with other universities in the region and expand access to a world-class education for students who may have been discouraged from enrolling at UIS by the cost of out-of-state tuition,” said UIS Chancellor Janet L. Gooch.

Students who live in St. Charles and St. Louis Counties in Missouri and Scott County in Iowa will be eligible for UIS’ in-state tuition rate. Undergraduate students from those counties will see their average tuition rate reduced by almost 50 percent. The average cost for in-state undergraduate tuition at UIS is $9,645 an academic year, compared to $19,410 for an out-of-state student.

“By implementing the pilot tuition program, UIS will position itself as an attractive option for out-of-state students seeking affordable tuition rates and access to high-quality education while also providing a welcoming and inclusive environment,” said Vickie Cook, UIS vice chancellor for enrollment and retention management.

The pilot program is expected to help to increase UIS’ enrollment, diversity, outreach, reputation and competitiveness in the region.

“This initiative is a win-win situation for both the university and the students,” Cook said. “The students will benefit from an excellent education and a vibrant campus experience.”

This pilot program is only open to on-campus undergraduate students. The students will be offered the in-state tuition rate for the duration of their degree program at UIS with financial assistance available to students who qualify.

Prospective students can learn more on the Admission website. Questions may be directed to the UIS Office of Admission at admissions@uis.edu or 217-206-4847.